Standards: Electronics Assembly: Process Support

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IPC-J-STD-001GS-AM1: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G. Requirements for Soldered Electrical...

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IPC-J-STD-001GA/A-610GA: Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G...

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IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

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IPC-2591: 互联工厂数据交换(CFX)

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IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-2591: Échanges au sein d’une usine connectée (CFX)

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IPC-2591: Connected Factory Exchange (CFX)-JP

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IPC-2591: Intercambio en fábricas conectadas (CFX)

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IPC-2591: Datenaustausch in der vernetzten Fabrik (CFX)

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-9111: 印制电路板组装工艺的故障排除

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IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1

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IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-J-STD-001G: Các Yêu Cầu Cho Các Sản Phẩm Điện và Điện Tử Hàn Lắp Ráp