Standards: Electronics Assembly: Process Support

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IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1

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IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-7525B-CN: 模板设计指导

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IPC-7525B: Stencil Design Guidelines

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components