Standards: Electronics Assembly: Process Support

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IPC-J-STD-001GS: Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G Anforderungen an gelötete elektrische und...

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IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

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IPC-9111: 印制电路板组装工艺的故障排除

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IPC-2591: 互联工厂数据交换(CFX)

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IPC-2591: Intercambio en fábricas conectadas (CFX)

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IPC-2591: Datenaustausch in der vernetzten Fabrik (CFX)

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-7711/21C: Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์

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IPC-J-STD-001G: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC-J-STD-001G: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC/JEDEC-J-STD-003D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC-9111: Troubleshooting for Printed Board Assembly Processes

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IPC-J-STD-001G: Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-J-STD-001G: 솔더링된 전기 및 전자 어셈블리들에 대한 요건들

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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten