J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
Standards: Electronics Assembly: Process Support
8 Products
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components
IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting