J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
Standards: Electronics Assembly: Process Support
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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级
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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-7092: Design and Assembly Process Implementation for Embedded Components
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IPC-7092: Design and Assembly Process Implementation for Embedded Components
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components
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IPC-SM-785-CN: 表面贴装焊接连接加速可靠性测试指南