IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本
Standards: Electronics Assembly: Process Support
32 Products
IPC-J-STD-001G-AM1: はんだ付される電気及び電子組立品に関する要件事項 改訂1
IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本
IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies
IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准
IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准
IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...
IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」
IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格
IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso
IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso
IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用
IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用
IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/WHMA-A-620A-DE: Rev A superseded by Rev B
IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
J-STD-075-CN: 组装工艺中非IC电子元器件的分级
J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble
IPC-A-610D-CZ: Acceptability of Electronic Assemblies
J-004A-CN: SUPERSEDED BY J-STD-004B-CN