Standards: Electronics Assembly: Process Support

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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

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IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

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J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

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J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001F-DK: Krav til loddede elektriske og elektroniske produkter

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IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

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IPC-A-610D-CZ: Acceptability of Electronic Assemblies

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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IPC-A-610F-FR: Acceptabilité des assemblages électroniques

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices