Standards: Electronics Assembly: Process Support

29 Products

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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610D-CZ: Acceptability of Electronic Assemblies

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610F-SE: Acceptanskrav för kretskort