IPC/JEDEC J-STD-609A Errata Information
Standards: Electronics Assembly: Process Support
17 Products
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IPC-7527: Requirements for Solder Paste Printing
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IPC-7527: 焊膏印刷要求 - Chinese
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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1
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IPC-AJ-820A: Assembly & Joining Handbook
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IPC-AJ-820A: Assembly & Joining Handbook
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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001
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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata
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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用
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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile
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IPC-9850A: Surface Mount Placement Equipment Characterization
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IPC-7525B-CN: 模板设计指导
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IPC-7525B: Stencil Design Guidelines
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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components
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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components