Standards: Electronics Assembly: Process Support

12 Products

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-7525B-CN: 模板设计指导

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IPC-7525B: Stencil Design Guidelines

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

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J-STD-004B-CN: 修订本 1 助焊剂要求

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components