J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés
Standards: Electronics Assembly: Process Support
9 Products
J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices