Standards: Electronics Assembly: Process Support

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21C-电子组件的返工、修改和维修

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-7095C-CN: BGA设计与组装工艺的实施

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IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

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IPC-A-610E-TR: Elektronik Takımların Kabul Edilebilirliği

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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IPC-A-610F-IL: קבלה של הרכבות אלקטרוניות

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IPC-A-610E-IL: Acceptability of Electronic Assemblies

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IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

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J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

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IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-A-610D-VN: Acceptability of Electronic Assemblies