Standards: Electronics Assembly: Quality/Test

120 Products

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IPC-CC-830C: 印制线路组件用电气绝缘化合物的鉴定及性能

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-J-STD-001GS: J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准

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IPC-WHMA-A-620C-Space: 航天应用电子部件补充标准

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IPC-J-STD-001G-AM1: 焊接的电⽓和电⼦组件要求 修订本

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IPC-9111: Troubleshooting for Printed Board Assembly Processes

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...