IPC-J-STD-001G-AM1: J-STD-001G-AM1-FR / Les exigences relatives au brasage d’assemblages électroniques et électriques.

IPC-9111: Troubleshooting for Printed Board Assembly Processes

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-J-STD-001G: Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки

IPC-7711/21C: Reprise, Modification et Réparation des Assemblages Électroniques

IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

IPC-A-610G: Acceptabilité des Assemblages Électroniques

IPC-A-610G:Acceptabilité des Assemblages Électroniques

IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001GS: Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences...

Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences des...

IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies