Standards: Electronics Assembly: Quality/Test

105 Products

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J-STD-001D: Rev D superseded by Rev E

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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J-004A: SUPERSEDED BY J-STD-004B

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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7095A(D)1: Design and Assembly Process Implementation for BGAs

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies