Standards: Electronics Assembly: Quality/Test

88 Products

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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7090-FAM: Packages for PCBs and Assemblies

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SolMatFAM: Solder Materials Family

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J-STD-001D: Rev D superseded by Rev E

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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J-004A: SUPERSEDED BY J-STD-004B

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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7095A(D)1: Design and Assembly Process Implementation for BGAs

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-A-610F: Acceptability of Electronic Assemblies