Standards: Electronics Assembly: Quality/Test

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC/WHMA-A-620C: IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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9702-WAM1: Monotonic Bend Characterization of Board-Level Interconnects

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices