Standards: Electronics Assembly: Quality/Test

88 Products

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-7801: Reflow Oven Process Control Standard

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC/WHMA-A-620C: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies