IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
Standards: Electronics Assembly: Rework/Repair
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IPC-7711/21B: Rework, modifikation og reparation af elektronikprodukter
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IPC-7711/21B-IT: Rilavorazione, Modifica e Riparazione di Assemblati Elettronici
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IPC-7711/21B-DE: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen
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IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies
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A-610DHU: Acceptability of Electronic Assemblies