IPC-A-610F: Acceptability of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
15 Products
J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์
IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici
J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1
IPC-AJ-820A: Assembly & Joining Handbook
J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata
IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用
IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile
IPC-AJ-820A: 组装和连接手册
J-STD-004B-CN: 修订本 1 助焊剂要求
T-50H-CN: 电子电路互连与封装术语及定义
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components