IPC-771/21C-AM1-English: Rework, Modification and Repair of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
9 Products
IPC-7711/21C: 电子组件的返工、修改和维修-修订本1
IPC-7095D-WAM1: ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1
IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
J-STD-004B-CN: 修订本 1 助焊剂要求
T-50H-CN: 电子电路互连与封装术语及定义
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components