Standards: Electronics Assembly: Rework/Repair

32 Products

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-AJ-820A: Assembly & Joining Handbook

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-AJ-820A: 组装和连接手册

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IPC-7525B: Stencil Design Guidelines

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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IPC-A-610E-IL: Acceptability of Electronic Assemblies

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IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága

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IPC-A-610E-CN: 电子组件的可接受性

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-004B-CN: 修订本 1 助焊剂要求

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...