IPC-771/21C-AM1-English: Rework, Modification and Repair of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
85 Products
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IPC-7711/21C: 电子组件的返工、修改和维修-修订本1
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IPC-7095D-WAM1: ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1
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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline
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IPC-7711/21C: 電子組件的返工、修改和維修
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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리
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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...
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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos
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IPC-7711/21C: Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych
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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1
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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása
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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques
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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア
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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos
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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-A-610F: Acceptability of Electronic Assemblies
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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์
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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici
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IPC-7095C: Design and Assembly Process Implementation for BGAs