Standards: Electronics Assembly: Rework/Repair

79 Products

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-7711/21C: 電子組件的返工、修改和維修

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos

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IPC-7711/21C: Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用