IPC-771/21C-AM1-English: Rework, Modification and Repair of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
39 Products
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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline
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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...
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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása
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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-A-610F: Acceptability of Electronic Assemblies
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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici
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IPC-7095C: Design and Assembly Process Implementation for BGAs
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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1
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IPC-AJ-820A: Assembly & Joining Handbook
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IPC-AJ-820A: Assembly & Joining Handbook
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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata
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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile
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IPC-7525B: Stencil Design Guidelines
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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen
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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie
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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử
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IPC-A-610E-HU: Elektronikai szerelvények elfogadhatósága
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IPC-A-610E-DK: Godkendelseskrav for elektronikprodukter