J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata
Standards: Electronics Assembly: Rework/Repair
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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用
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IPC-AJ-820A: 组装和连接手册
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J-STD-004B-CN: 修订本 1 助焊剂要求
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T-50H-CN: 电子电路互连与封装术语及定义
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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
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A-610DHU: Acceptability of Electronic Assemblies