Standards: Electronics Assembly: Rework/Repair

6 Products

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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Nonmember: $184.00

IPC-7095C: Design and Assembly Process Implementation for BGAs

Member: $84.00

Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $63.00

Nonmember: $119.00

7095B(D)1: Design and Assembly Process Implementation for BGAs

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Nonmember: $492.00

IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása