Standards: Electronics Assembly: Rework/Repair

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7525B: Stencil Design Guidelines

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components