IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Standards: Electronics Assembly: Rework/Repair
IPC-7525B: Stencil Design Guidelines
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components