IPC-7095C: Design and Assembly Process Implementation for BGAs
Standards: Electronics Assembly: Rework/Repair
7 Products
IPC-7095C: Design and Assembly Process Implementation for BGAs
J-STD-004B-CN: 修订本 1 助焊剂要求
T-50H-CN: 电子电路互连与封装术语及定义
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components