IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Standards: Electronics Assembly: Rework/Repair
4 Products
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components