J-STD-004B-CN: 修订本 1 助焊剂要求
Standards: Electronics Assembly: Rework/Repair
11 Products
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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
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T-50H-CN: 电子电路互连与封装术语及定义
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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici
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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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IPC-A-610F: Acceptability of Electronic Assemblies
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F
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IPC-A-610F: Acceptability of Electronic Assemblies