Standards: Electronics Assembly: Rework/Repair

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components