Standards: Electronics Assembly: Rework/Repair

4 Products

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components