Standards: Electronics Assembly: Rework/Repair

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F