IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components