IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
Standards: Electronics Assembly: Rework/Repair
2 Products
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components