Standards: Electronics Assembly: Rework/Repair

108 Products

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

Member: $281.00

Nonmember: $562.00

IPC-7711/21C: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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IPC-7711/21C: Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C-电子组件的返工、修改和维修

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7090-FAM: Packages for PCBs and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-J-STD-020E: Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial...

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1