Standards: Electronics Assembly: Rework/Repair

102 Products

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-7711/21C-电子组件的返工、修改和维修

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7090-FAM: Packages for PCBs and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-J-STD-020E: Clasificación de la sensibilidad a la humedad / reflujo de dispositivos de montaje superficial...

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IPC-A-610F: Acceptability of Electronic Assemblies

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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IPC-A-610F-TH: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile