Standards: Electronics Assembly: Solderability

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IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊

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IPC-HDBK-005: 焊膏评估指南

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-4550-FAM: Plating Specifications

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7090-FAM: Packages for PCBs and Assemblies

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SolMatFAM: Solder Materials Family

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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4562A-CN: 印制板用金属箔