IPC-7530A: 群焊工艺温度曲线指南（再流焊和波峰焊

IPC-HDBK-005: 焊膏评估指南

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

4562A-CN: 印制板用金属箔

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-001E-CN: Rev E superseded by Rev F

J-STD-003C-CN-WAM1: 印制板可焊性测试

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...