Standards: Electronics Assembly: Solderability

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IPC-HDBK-005: 焊膏评估指南

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A-JP: ソルダペーストに関する要求事項