Standards: Electronics Assembly: Solderability

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly