IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
Standards: Electronics Assembly: Solderability
13 Products
IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...
J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范