Standards: Electronics Assembly: Solderability

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IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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Nonmember: $130.00

J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

Member: $88.00

Nonmember: $176.00

IPC-7095C: Design and Assembly Process Implementation for BGAs