IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
Standards: Electronics Assembly: Solderability
13 Products
J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies
IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
J-STD-003C-CN-WAM1: 印制板可焊性测试
IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1
1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2
IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014
J-STD-004B-CN: 修订本 1 助焊剂要求
T-50H-CN: 电子电路互连与封装术语及定义
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies
IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum