Standards: Electronics Assembly: Solderability
IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum
IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1
IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies
1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2
J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies
IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...
IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1