IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
Standards: Electronics Assembly: Solderability
12 Products
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-AJ-820A: Assembly & Joining Handbook
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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...
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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001
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IPC-4562A-WAM1: Metal Foil for Printed Board Applications
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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F
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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-7095C: Design and Assembly Process Implementation for BGAs