Standards: Electronics Assembly: Solderability
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...
IPC-4550-FAM: Plating Specifications
7090-FAM: Packages for PCBs and Assemblies
SolMatFAM: Solder Materials Family
IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001
IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-AJ-820A: Assembly & Joining Handbook