Standards: Electronics Assembly: Solderability

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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4562A-CN: 印制板用金属箔

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7095C: Design and Assembly Process Implementation for BGAs