Standards: Electronics Assembly: Solderability

16 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001E-SE: Krav för lödda elektriska och elektroniska kretskort

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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IPC-HDBK-005: Guide to Solder Paste Assessment

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7095C: Design and Assembly Process Implementation for BGAs