Standards: Electronics Assembly: Solderability

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-HDBK-005: Guide to Solder Paste Assessment