Standards: Electronics Assembly: Solderability

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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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4562A-CN: 印制板用金属箔

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications